Areas of Plasma Application

09.

PCB/FPCB Industry

  • - AP plasma (M electrode) is applied to the pretreatment process for PCB substrate plating/SMT/flip chip bonding process
PCB/FPCB Industry
AP Plasma - APM 200
AP Plasma - APM 200
APM’s Appearance Drawing
APM’s Appearance Drawing

AP Plasma - APM

  1. 1. Applied to the pretreatment process for PCB substrate plating, and the surface treatment process before SMT/Flip chip bonding
  2. 2. Applied to the surface treatment process for flexible PI film substrate and polymer substrate
  3. 3. Low-temperature processing (below 40 ℃) is possible, and it does not require consumable parts

Specification

specification

Unit : mm

* D1 x D2 – Docking point (M6 bolt x 4ea)
200M 300M 300M
A 282.4 382.4 482.4
B 95 95 95
C 130 130 130
D1* 384.4 448.4 548.4
D2* 110 110 110
E 318.4 418.4 518.4
Plasma
Area		 210 310 410
Weight 5Kg 6Kg 7Kg
Brochure Movement
  • - AP plasma roll-to-roll equipment is applied to the surface treatment process for FPCB FCCL PI films
APM – R1600
APM – R1600
  • - Vacuum plasma equipment used in PCB decontamination process
Vacuum Plasma Desmear - PVS-DE950
Vacuum Plasma Desmear - PVS-DE950

Specification

Electrode quantity 17 EA (Vertical Type)
Number of processed products (FR4) PCB (550*500 mm2) 16 EA
Equipment 2000×1500×2000 mm3 (W×L×H)
Chamber 1000×1000×950 mm3 (W×L×H)
Power MF 40 khz, 10 kW
Electrode cooling Water cooling type
Chiller 5 HP (5 kVA)
Control PLC control (touch monitor)
MFC O2, CF4, N2, Ar

Vacuum Plasma Desmear

  1. 1. Uniform removal of epoxy residues (smear) generated during the PCB drilling process / Securing product reliability
  2. 2. It consumes a small amount of gas, and has a low running cost due to no chemical disposal cost
  3. 3. Various plasma treatment processes are possible, which enables hydrophilic surface modification, and reduction process, so on in addition to de-smearing.