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    • Pretreatment before wire bonding process to improve bonding strength and to decrease bonding failures.

 

    • Electrode Size : 118mm(W) x 53.5mm(D) x 57mm(H)

    • Power Supply Size : 155mm(W) x 230mm(D) x 260mm(H)

    • Plasma Treatment Time : 0.5 ~ 3 min (depend on Substrate)

    • Power Supply : Max. 300W

    • Utility : N2(~ 20 l/min), Air(~100sccm), Forming Gas

    • Application Substrate : BGA, QFN

    • Synchronize with Wire Bonder Controller

 

    • In-Line process (AP Module + Wire bonder)

    • Substitute Present Vacuum Plasma Cleaning System

      Support In-Line Process, Increase UPH

    • No Surface Damage, Process consistency

    • Easy Installation and Simple Operation with

      Convenient Maintenance