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    Surface Cleaning/Modification to Improve Adhesion

      Strength between Substrate and Epoxy for Die Attach.

      Solve Void or De-lamination problems,

 

    • Magazine Loader & Un-loader

    • Loader Dimension : 950(W)×900(L)×1,540(H)

    • Un-loader Dimension: 785(W)×900(L)×1,430(H)

    • Treatment Speed: 10-50 mm/s

    • Plasma Generator: 20~50 kHz/ 4~ 8 kW

    • Process Gas : CDA(Air), N2

    • Substrate: BOC, WBGA, uBGA

    • Increase Adhesion Between Substrate and Die

     Substitute Present Vacuum Plasma Cleaning System       Support In-Line Process, Increase UPH

    • No Surface Damage, Excellent Performance

    • Easy Installation and Simple Operation with     

      Convenient Maintenance