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    • Pretreatment before Encap./Molding process to decrease the die-top delamination.

 

    • Electrode Size : 220mm(W) x 120mm(D) x 45(80)mm(H)

    • Power Supply Size : 266mm(W) x 605mm(D) x 482mm(H)

    • Plasma Treatment Time : 5 ~ 10 sec (depend on Substrate)

    • Power Supply : Max. 4kW

    • Utility   : N2(~ 20 l/min), Air(~100sccm)

    • Application Substrate : BGA, QFN

 

    • In-Line process (AP Module + Molding Machine)

    • Substitute Present Vacuum Plasma Cleaning System

      Support In-Line Process, Increase UPH

    • No Surface Damage, Process consistency

    • Easy Installation and Simple Operation with

      Convenient Maintenance